water cooling plate for IGBT modules
The water cooling plate for IGBT modules is formed by burying pipes, drilling, microchannel processing, double-layer welding and other methods on the substrate to form a flow channel, which carries away heat through flow. There are mainly shallow buried pipe process, deep buried pipe process, welded pipe process, and double-sided clamping pipe process. Our water cooling plate for IGBT modules is made by shallow buried tube technology with aluminum alloy substrate embedded with copper pipes.
It has the following advantages:
- By utilizing the corrosion resistance of copper and the high thermal conductivity of aluminum, efficient heat dissipation can be achieved
- The product has high strength and can withstand greater loads without being damaged
- Good stability, the surface of the product can form an oxide film, which has strong corrosion resistance and oxidation resistance, so it can extend the service life of the product
- The product has been polished and oxidized, making it beautiful, durable, and easy to install
- The length and curvature of the protruding water pipe can be adjusted according to the process requirements
If you have any questions about this product, please feel free to contact us and we will provide you with professional pre-sales service.
We have been engaged in the research and development, production, and sales of IGBT induction power supplies for many years. After years of experience and summary, this water cooling plate for IGBT modules is very useful. If you have other different needs, you can also contact us and we will provide you with exclusive customized services.
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